The provided diagram illustrates the various stages involved in the manufacturing of circuit boards, from the initial delivery of raw materials to the final distribution of the finished products to factories.
Overall, the production process is a linear sequence that incorporates two critical quality control stages. Throughout the manufacturing cycle, there are specific points where defective components are identified and discarded, ensuring that only high-quality boards proceed to the final packaging stage.
The process begins with the delivery of circuit-board material, which is subsequently cut and sprayed with fire retardant. Following this, the material undergoes a cleaning phase before moving to the automated IC attachment and soldering stage. Once the components are attached, the boards are subjected to a visual inspection and quality control testing. If any boards fail this inspection, the chips are removed and discarded, while the remaining boards proceed to final testing.
During the final testing phase, any further defects result in the chips being thrown away. Boards that pass this final assessment are then packaged and prepared for delivery to factories. This systematic approach ensures that only functional circuit boards reach the end of the production line.